מקום מוצא
Guangdong, China
דקות . גודל חור
0.1mm (4mil)
דקות . רוחב קו
1/2 oz. copper .003" +/- .0005" (0.0762mm)
דקות . מרווח בין שורות
1/2 oz. copper .003" +/- .0005" (0.0762mm)
משטח גמר
HAL, HASL(LF), Immersion gold, Gold plating,
Base, Cover film, Stiffeners thickness:
0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um
BGA Ball Pitch
1mm ~ 3mm(4mil ~ 12mil)
Hi-TG FR4 Material
Tg-130 Tg-140 Tg-160 Tg-170
PCB Test
Flying probe and AOI (Default)/Fixture Test
PCB Assembly Method
SMT, Through-hole, Mixed, BGA
PCB Assembly Test
Visual Inspection (default), AOI, FCT, X-RAY
Electrical Testing
Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test
Certificate Standard
IPC-A-600H Class 2, Class 3, TS16949,,ROHS and as your need
Special requirements
Buried and blind vias, Impedance control, via plug, BGA soldering etc.
